Next-generation high-speed processing & high-resolution 3D CT X-ray automatic inspection system
X-ray & CT
Measurement
The world's highest resolution of 0.16um. High-end X-ray inspection system (TI-X900s)
High Resolution Imaging
By increasing the resolution compared to the previous model (from 0.25pm to 0.16um), the TI-X900s achieves higher resolution imaging and is suitable for inspection of cutting-edge semiconductors.
High-definition 3D Imaging
Clear, high-definition 3D images can be acquired thanks to XY stage positioning by high-precision linear scale.
By increasing the resolution compared to the previous model (from 0.25pm to 0.16um), the TI-X900s achieves higher resolution imaging and is suitable for inspection of cutting-edge semiconductors.
High-definition 3D Imaging
Clear, high-definition 3D images can be acquired thanks to XY stage positioning by high-precision linear scale.
TI-X900s | ||
검사 | Work 사이즈 | 30 x 30 ~ 600 x 620 mm |
FOW 사이즈 | Fluoroscopy : 0.35 x 0.45 ~ 23.0 x 29 mm | |
측정 영역 | Fluoroscopy : 600 x 620 mm | |
X-ray | Micro focus spot open tube Diamond / LaB6 | |
검출기 | 6.8M pixels | |
분해능 | Fluoroscopy : 0.16 ~10.0 μm | |
CT 각도 | 45~60° | |
이미지 슬라이스 수 | 512 (최대 1000) | |
CT 스캔 | 8~360 shots | |
X-Y 이동 | 선형 모터 드라이브 | |
Air supply | 0.5~0.6Mpa (Φ8 tube or 20PM) | |
전원전압 | Single phase AC200~240 V ±10%, 50/60 Hz | |
소비전력 | 10 kVA or less | |
설치 환경 | 22℃±2℃, 50%±10% PH | |
X-ray 누설량 | 0.5μSV/h or less | |
크기 | 1630(W) x 2200(D) x 1940(H) mm | |
무게 | 5500 kg | |
■ The world's highest resolution of 0.16um. High-end X-ray inspection system (TI-X900s)
Measurement
Inline X-ray automatic inspection system (TI-X700i)
■ Inline X-ray automatic inspection system (TI-X700i)
Measurement
Next-generation high-speed processing & high-resolution 3D CT X-ray automatic inspection system
